Industry sources said that due to strong demand from four major customers, Taiwan Semiconductor is also expanding its SoIC production capacity, and by the end of this year, its monthly capacity will increase from the current level of about 2,000 wafers at the end of 2023 to 4,000-5,000 wafers, with a chance to reach more than 8,000 wafers in 2025. Yongxing Securities believes that the importance of advanced packaging in the era of computing power is gradually becoming prominent, and the related industry chain is expected to continue to benefit.
Industry sources said that Taiwan Semiconductor is also expanding its SoIC capacity due to strong demand from its four major clients. By the end of this year, the monthly production capacity will increase from about 2,000 wafers at the end of 2023 to 4,000-5,000 wafers. There is a chance that it will reach over 8,000 wafers by 2025 and double again by 2026 to meet the strong demand for future AI and HPC.
The development speed of Moore's Law is slowing down, and the number of transistors that can be squeezed into a chip is becoming more and more limited, highlighting the importance of chip packaging technology. SoIC, as a 3D stacking technology, integrates different chips such as processors, memory, and sensors into the same package, which can reduce the volume of chipsets, enhance functionality, and save power. TrendForce points out that the continuous growth in demand for AI servers has driven the progress of various advanced packaging technologies, including InFO, CoWoS, and SoIC. The development of advanced packaging has not only improved the equipment and material requirements of traditional packaging processes, but also contributed new application scenarios for upstream equipment and advanced materials. Yongxing Securities believes that the importance of advanced packaging in the era of computing power is gradually becoming prominent, and the related industry chain is expected to continue to benefit.
