On August 6th, KOLON Industries announced that the company has signed a non-binding preliminary memorandum of terms (PMT) with the United States Department of Commerce. Based on the CHIPS and Science Act, SK hynix will receive a maximum of $450 million in direct subsidies and $500 million in loans for investment in an advanced semiconductor packaging factory in Indiana, USA.
SK海力士：将获得美国芯片法案最高4.5亿美元直接补助和最高5亿美元贷款
SK hynix: will receive a maximum of $0.45 billion in direct subsidies and a maximum of $0.5 billion in loans from the US chip law.
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