Recently, the world's second largest memory chip manufacturer SK Hynix announced that it has decided to invest about 9.4 trillion Korean won (approximately RMB 49.34 billion) in building the first local chip factory in Yeongju, South Korea. According to the plan, SK Hynix will start building the first plant of the Yeongju cluster in March next year and complete it in May 2027.

Huaxin Securities analyst Mao Zheng pointed out that with the rise of AI, the demand for high computing power and bandwidth has driven the development of storage. Compared with traditional DRAM, HBM technology uses vertically stacked DDR chips and GPU packaging to achieve high bandwidth, low delay, and low power consumption, breaking the limitations of traditional memory and adapting to new demands in the AI era. At present, the global market is dominated by Hynix, Samsung, and Micron, and Chinese manufacturers are also actively promoting the localization of HBM. The market supply and demand gap is still expanding, and with the AI driving the rise of DRAM prices and HBM, the price is expected to continue to rise, and the market size is expected to reach about $7 billion in 2024. It is worth mentioning that in May this year, SK Hynix President Kwak Noh-Jung revealed that SK Hynix's HBM chips for this year have been sold out, and most of the HBM chips for 2025 have already been booked.

According to the Financial Data Center, among related listed companies:

Tongfu Microelectronics is an international leading packaging and testing company with seven production bases worldwide. The company stated that it will continue to pay attention to HBM technology and actively carry out related research and development work.

JCET Group Co., Ltd.'s XDFOI high-performance packaging technology platform can support HBM packaging requirements.