According to industry sources, Taiwan Semiconductor has officially established a team for FOPLP (Fan-Out Panel Level Packaging) and plans to establish a mini line for small-scale production. FOPLP replaces traditional circular silicon interposers with large rectangular substrates, which results in larger packaging size, higher area utilization, and lower unit costs, thereby addressing the current shortage of advanced CoWoS packaging capacity.

After many years of development and accumulation, semiconductor chip packaging technology has become mature. Nowadays, there are hundreds of packaging types. Among these hundreds of packaging types, Fan-out packaging has gradually become the focus, and it is considered a key technology solution to continue and surpass Moore's Law. There are currently two technological branches of fan-out packaging, namely Fan-Out Wafer Level Packaging (FOWLP) and Fan-Out Panel Level Packaging (FOPLP). Guojin Securities pointed out that compared with the traditional CoWoS, Fan-Out Panel Level Packaging technology has larger packaging size and better heat dissipation performance, which makes it more able to support larger-scale chip integration, improve performance and reduce power consumption. Therefore, for AI chip manufacturers such as Nvidia, adopting FOPLP technology can help alleviate the current shortage of CoWoS production capacity and increase the supply of AI chips. The demand for high-end chips continues to grow, and advanced packaging provides technical support for improving chip performance and integration to continue Moore's Law. With the continuous advancement of advanced packaging technology, various industry chains (packaging and testing/equipment/material/IP, etc.) will continue to benefit.

According to the Financial Data Center, among related listed companies:

JCET Group Co., Ltd. is a global leading company in the production of finished chips, with relevant technologies for Fan-out Panel Level Packaging.

Shenzhen JT Automation Equipment's chip packaging heat treatment equipment can be applied to the inverted chip welding process in the field of fan-out packaging.