据财联社主题库显示，相关上市公司中：JEDEC Solid State Technology Association, an industry standard-setting organization, recently released a press release announcing that the HBM4 standard is about to be finalized. The world's three largest memory manufacturers, SK Hynix, Samsung, and Micron, are actively investing in high-frequency and wide-bandwidth memory (HBM) production expansion plans. Market insiders estimate that by 2025, the new chip output will be about 0.276 million pieces, and the total capacity will increase to 0.54 million pieces, a year-on-year increase of 105%. Product structure: 4.01/12.88/0.06 billion yuan for 100-300 billion yuan products operating income respectively.
JEDEC Solid State Technology Association, an industry standard-setting organization, recently released a press release announcing that the HBM4 standard is about to be finalized. In addition to higher bandwidth, lower power consumption, and increased bare die/stack capacity, it further improves data processing speed.
Sinolink's Fan Zhiyuan believes that HBM solves the "memory wall" problem encountered by traditional GDDR, adopts a near-storage computing architecture that combines storage and computing, and connects signal processor chips tightly and quickly through the intermediate medium layer, greatly saving data transmission time and energy consumption. HBM's use of stacking technology saves much space compared to traditional GDDR. Overall, its high bandwidth, low power consumption, and efficient transmission performance make it the preferred choice for high computing power chips. The global HBM output value in 2023 is about 4.36 billion US dollars, and it is expected to reach 16.9 billion US dollars in 2024, an increase of four times. It is worth mentioning that the world's three largest memory manufacturers, SK Hynix, Samsung, and Micron, are actively investing in high-frequency and wide-bandwidth memory (HBM) production expansion plans. Market insiders estimate that by 2025, the new chip output will be about 0.276 million pieces, and the total capacity will increase to 0.54 million pieces, a year-on-year increase of 105%.
According to the Financial Data Center, among related listed companies:
Novoray's materials for partial packaging customers are globally renowned enterprises in Japan and South Korea. The company has matched and supplied products such as Lowα silicon and Lowα aluminum in batches. The company belongs to upstream materials of HBM chip packaging materials.
In the mid-year report preview of Yoke Technology in 2024, downstream products such as storage and logic chips and high-bandwidth memory (HBM) for AI grew rapidly, and the sales of the company's semiconductor electronic materials increased significantly.
