Onto Innovation Inc. (NYSE:ONTO) today announced Onto Innovation's glass substrate suite featuring the JetStep X500 panel-level packaging lithography system with hybrid substrate handling capabilities and the Firefly G3 sub-micron automatic metrology and inspection system for panel-level packaging and advanced IC substrates (AICS). The JetStep X500 and Firefly G3 systems offer customers a complete panel-level packaging solution supporting heterogeneous integration (HI) chiplet packages for AI, high performance compute and cloud computing. The AICS market is expected to increase at a compound annual growth rate of 10% from 2023 to 2028, according to Prismark.

The AICS HI roadmap is rapidly approaching several new...