苹果公司将导入 台积电 3D 先进封装 技术。台积电先进封装3D平台SoIC(SystemonIntegratedChips)再添重量级客户，苹果将大规模采用，预计2025年放量。如果消息属实，这将是继AMD之后，台积电该技术获得的又一大客户订单。相关个股： 沃格光电 (603773)、 强力新材 (300429)等产业链公司。
苹果公司将导入台积电3D先进封装技术
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