AMD与 英伟达 需求推动FOPLP发展。自 台积电 于2016年开发命名为整合扇出型封裝(InFO)的扇出型晶圆级封裝(FOWLP)技术，并应用于iPhone7手机所使用的A10处理器后，专业封测代工厂竞相发展FOWLP及扇出型面板级封裝(FOPLP)技术，以提供单位成本更低的封装解决方案。自第二季起，超威 半导体 (AMD)等芯片厂商积极接洽台积电及代工厂以FOPLP技术进行芯片封装，带动业界对FOPLP技术的关注。相关个股： 华海诚科 (688535)、 华天科技 (002185)。
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AMD与英伟达需求推动FOPLP发展
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