Morgan Stanley released a report indicating that Apple (AAPL.US) may adopt Taiwan Semiconductor's (TSM.US) SoIC chip stacking technology in the next generation of artificial intelligence servers in the second half of next year. In 2024, Apple announced at the WWDC conference its private cloud computing architecture, running on Apple Silicon servers. Based on the expansion of user base for private cloud computing, it is estimated that Apple will use 3nm M3/M4 Ultra chips to produce more artificial intelligence server chips. By the second half of next year, Apple will adopt Taiwan Semiconductor's SoIC chip stacking technology to produce more efficient M5 chips. It is believed that Taiwan Semiconductor will significantly expand its SoIC production capacity next year.

Morgan Stanley suggests that Taiwan Semiconductor may expand its production capacity, which is positive news for semiconductor packaging equipment supplier Besi (BESI), and it is also estimated that ASMPT's (00522.HK) thermocompression bonding (TCB) equipment may also be applied to Taiwan Semiconductor's SoIC technology, but the terminal customer identity has not been confirmed.