7月2日，沪深两融数据显示，金道科技获融资买入额0.18亿元，居两市第583位，当日融资偿还额0.22亿元，净卖出354.91万元。
最近三个交易日，28日-2日，金道科技分别获融资买入0.28亿元、0.21亿元、0.18亿元。
融券方面，当日融券卖出0.00万股，净卖出0.00万股。
金道科技获融资买入0.18亿元，近三日累计买入0.67亿元
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