Jingsheng Mechanical & Electrical (300316.SZ) investor interactive platform stated that in the field of semiconductor equipment, the company actively develops large silicon wafer manufacturing, chip manufacturing, packaging and other equipment, and gradually achieves a breakthrough in the localization of 8-12-inch semiconductor large silicon wafer equipment. Related products have achieved batch sales and have been widely recognized by downstream customers, leading the market share in domestic semiconductor long crystal equipment. The fully automatic single crystal silicon growth furnace product was selected for the list of leading companies in the field of national semiconductor device special equipment standards. The company's single-piece silicon epitaxial growth equipment was awarded the 15th China Semiconductor Equipment Innovation Product. Based on the extension of the industry chain, the company has developed 6-8 inch silicon carbide crystal growth equipment, slicing equipment, thinning equipment, polishing equipment and epitaxial equipment in the field of power semiconductors. The company has also developed 8-12 inch atmospheric silicon epitaxial equipment and achieved the localization of silicon carbide epitaxial equipment, and innovatively launched a double-piece silicon carbide epitaxial equipment, significantly improving the epitaxial capacity. The company has developed 8-12 inch reduced pressure silicon epitaxial equipment, LPCVD, ALD equipment and other devices in the advanced process field, and has developed a variety of 12-inch wafer thinning equipment for advanced packaging. The company will continue to leverage the industry development trend and opportunities of the domestic substitution of semiconductor equipment, accelerate the layout of core equipment in the semiconductor industry chain, and seize the market of domestic substitution of semiconductor equipment with its core advantage in innovation capability.