According to the Wisdom Financial APP, ASMPT (00522) rose nearly 4%. As of press time, it rose 3.77% to HKD 107.30, with a turnover of HKD 64.0287 million.

On the news front, according to market media reports, the demand for AI servers continues to rise, and Taiwan Semiconductor is accelerating the CoWoS expansion. Equipment vendors said that the current CoWoS supply gap is quite serious. Although equipment factories have delivered goods one after another in recent periods, the growth rate of demand has exceeded expectations. In order to meet market demand, Taiwan Semiconductor has once again placed urgent orders with equipment manufacturers and plans to increase production capacity year by year. According to estimates, monthly production capacity will reach 32,000 pieces in the second half of 2024 and gradually increase to 58,000 pieces in 2028; in addition, production capacity will further increase after the new factory in Chiayi is put into use.

It is reported that ASMPT is the main supplier of TCB (Thermal Compression Bonding) for 2.5D advanced packaging, and the technology is applied to Taiwan Semiconductor's CoWoS and HBM products.