Xiamen Guang Pu Electronics (300632.SZ) stated on the investor interaction platform on June 26 that the company has made a breakthrough in the stacked packaging technology of its semiconductor optical sensors, which is a crucial technology for semiconductors. The company has not yet been connected with the third phase of the national fund.
光莆股份(300632.SZ)：与国家第三期大基金未对接
Xiamen Guang Pu Electronics (300632.SZ): not connected with the third phase of the national fund.
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