On June 24th, Gelunhui reported that Weitouou (301319.SZ) stated on the investor interaction platform that the company's bottom filling glue is mainly used for the protection of BGA chips, and does not have electromagnetic shielding effect. The company continues to increase research and development in the field of new materials and provide customers with reliable material solutions.
唯特偶(301319.SZ)：底部填充胶主要用于BGA芯片的保护作用，没有电磁屏蔽的作用
Weituo (301319.SZ): Bottom filling glue is mainly used for the protection of BGA chips, without electromagnetic shielding function.
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