ST Huami (600360.SH) stated on the investor interaction platform on June 24 that the company has not yet carried out business related to semiconductor chip packaging glass substrates.
ST华微(600360.SH)：暂未开展半导体芯片封装玻璃基板业务
ST Huami (600360.SH) has not yet carried out business in glass substrates for semiconductor chip packaging.
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