TGV in the packaging field refers to the glass substrate filling process. The advantage of TGV over TSV lies in the excellent high-frequency electrical properties, low cost, easy availability and strong stability of glass substrates, which is another revolution in packaging technology.

The company has already conducted research and development and technical reserves for glass substrate via hole filling. They have successfully developed the SkyFab THF series products for TGV and are now seizing the opportunity to expand downstream. The company is currently in close contact with all parties involved in glass substrate and actively provides sample services to promote industry progress together.