On June 19th, Gelunhui reported that Jiangbolong (301308.SZ) said on the investor interaction platform that CoWoS (Chip-on-Wafer-on-Substrate) is a type of 2.5D packaging technology. This technology allows multiple small chips (or called bare chips) to be packaged onto one substrate, achieving higher integration, enhanced chip interconnectivity, and reduced power consumption. CoWos is mainly developed by Taiwan Semiconductor and is currently mainly used in the field of storage chip packaging, mainly for HBM products, as well as CPU/GPU. However, for the NAND Flash products that the company mainly engages in, CoWos is not yet widely used. Therefore, the company does not have mature technology for CoWos, but it keeps an eye on and understands advanced packaging technologies including CoWos.
江波龙(301308.SZ)：不具备CoWos的成熟技术
Jiangbolong (301308.SZ): Does not have mature technology for CoWos.
The translation is provided by third-party software.
The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.