WG Tech (603773.SH) stated on the investor interaction platform on June 18th that the company has the ability to use glass-based PVD thick copper plating technology to reduce line resistance while improving line precision. The company's TGV technology capabilities include thick copper plating technology, with application prospects in Mini/Micro LED new displays and semiconductor board-level packaging substrates.
沃格光电(603773.SH)：具备玻璃基PVD厚镀铜技术能力
WG Tech (603773.SH) has the capability to perform thick copper plating on glass through PVD technology.
The translation is provided by third-party software.
The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.