On June 18th, Gelunhui reported that Debond Technology (688035.SH) stated on the investor interactive platform that the company's thermal interface materials (TIM materials) include TIM1, TIM1.5, and TIM2. Among them, TIM1.5 and TIM2 have been stably shipped in batches and applied to many fields such as consumer electronics, network communications, and new energy vehicles. Because the company has signed a confidentiality agreement with relevant customers, customer information and cooperation project progress cannot be disclosed at this time. TIM1 is mainly used for inverted chip packaging and can be used for high computing chips. The direct customer is the testing and packaging factory, and it is unknown whether the product is specifically applied in the AI field. Currently, the company's TIM1 material is still in the stage of verification and import.