On June 18th, Gelonhui reported that Huizhou Speed Wireless Technology (300322.SZ) stated on an investor interactive platform that its joint venture company, Suzhou Keyang, mainly engages in wafer-level advanced packaging services for CIS chips and filter chips.
硕贝德(300322.SZ)：参股公司苏州科阳主要从事CIS 芯片和滤波器芯片的晶圆级先进封装服务
Huizhou Speed Wireless Technology (300322.SZ): Participating company Suzhou Keyang mainly provides advanced wafer-level packaging services for CIS and filter chips.
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