Wuhan DR Laser Technology Corp. (300776.SZ) stated on the investor interactive platform that the company's TGV laser micropore equipment can achieve micropore and microgroove processing on glass substrates of different materials through precision control systems and laser modification technology, providing conditions for subsequent metalization processes, and can be applied to related fields such as semiconductor chip packaging and display chip packaging.
帝尔激光(300776.SZ)：TGV激光微孔设备可应用于半导体芯片封装、显示芯片封装等相关领域
Wuhan DR Laser Technology Corp. (300776.SZ): TGV laser micro-hole equipment can be applied in related areas such as semiconductor chip packaging and display chip packaging.
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