On June 14th, GeLongHui reported that Taik Jing Technology (688072.SH) announced on the interactive platform that the company has launched two hybrid bonding equipment. In 2023, the wafer-to-wafer bonding product (Dione 300) obtained customer verification, achieved industrial application, and became the first domestically produced hybrid bonding equipment used for mass production. Currently, the performance and capacity indicators of the device have reached international leading level. In addition, the chip-to-wafer bonding surface pre-processing product (Propus) passed customer verification and became the first domestically produced product of the same type used for mass production. Hybrid bonding equipment is mainly used in the field of 3D integration, covering subdivisions such as storage/logic chips, advanced packaging, and image sensors. The potential market space is large in the future.