According to a recent industry channel survey, Taiwan Semiconductor's (TSM.US) advanced packaging technology CoWoS production capacity for the first half of next year has already been fully booked, and the company is negotiating with customers for allocation of production capacity for the second half of next year. Price is believed to be one of the topics for discussion, and it is believed that Taiwan Semiconductor may raise prices of all its AI acceleration products by 5% to 10% next year, which will help promote a new round of profit forecast reevaluation. In response to strong demand from customers, CoWoS production capacity for the second half of next year is expected to further increase.

The report points out that Apple (AAPL.US), Taiwan Semiconductor's largest customer, has released new AI features, and it is believed that Apple's annual wafer orders forecast will increase, and Apple's sales prospects will improve, which is expected to drive Taiwan Semiconductor to raise its guidance target for this year. It is also believed that Taiwan Semiconductor's gross margin will return to a healthier level next year, and its Taiwan stock target price has been raised from NT$900 to NT$1,050, maintaining a "buy" rating, and it remains the most attractive company in the AI field.

Taiwan Semiconductor's Taiwan stock closed at NT$922, up 0.3% today (14th). (CY/U)

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