According to media reports, at the end of this month, the first domestic photon chip pilot line will enter the equipment debugging sprint stage. Data shows that the Wuxi Photon Chip Research Institute of Shanghai Jiaotong University was established in December 2021. It is jointly built by the People's Government of Binhu District, Shanghai Jiaotong University, and Liyuan Economic Development Zone, located in Liyuan Development Zone. The project will be capped in October 2023 and the first batch of equipment for the photon chip pilot line will enter in January 2024.

It is reported that the first photon chip pilot line, focusing on the research and development of high-end photon chips and aiming at the application of the new generation of information technology and industrialization, aims to promote the landing and transformation of transformational technologies such as quantum computers, general-purpose photon processors, 3D photonic interconnect chips, and high-precision femtosecond laser direct writing machines. Open source securities pointed out that the rapid development of silicon photonics technology in recent years has brought about significant technological innovations to many industries. As traditional microelectronics and optoelectronic technologies gradually enter the "post-Moore era", the silicon photonics industry chain is gradually improving. As a platform technology, silicon photonics technology's high speed, high integration, low cost, low power consumption, and miniaturization are gradually highlighted, and it is being widely used in multiple areas including optical communication, optical sensing, and optical computing. Silicon photonics technology is gradually ushering in a historic opportunity period.

According to the Financial Data Center, among related listed companies:

Sai Microelectronics Inc.'s overseas MEMS production line's silicon photon chip manufacturing technology is relatively mature, and it has experience in process development and mass production, and has been supplying to well-known European and American manufacturers for a long time.

Konfoong Materials International states that the photon chip transfers information through electro-optic conversion and optoelectronic conversion, and requires the use of ultra-high-purity metal target materials to make chip interconnect wires. The company's ultra-high-purity copper and copper alloy target materials are one of the most widely used advanced semiconductor conductive layer thin film materials.