On June 13th, Gelonhui reported that Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform that the company grasps the market development opportunities, focuses on future high value-added products and market hot spots, and takes a long-term perspective to vigorously develop packaging technologies such as fan-out, wafer-level, and inverted welding, and expand its production capacity. In addition, the company actively layouts Chiplet, 2D+ and other packaging technologies to form differentiated competitive advantages.
通富微电(002156.SZ)：积极布局Chiplet、2D+等封装技术
Tongfu Microelectronics (002156.SZ) is actively developing packaging technologies such as Chiplet and 2D+.
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