Tongfu Microelectronics (002156.SZ) stated on the investor interaction platform on June 13th that the company has technical reserves related to glass substrate packaging.
通富微电(002156.SZ):具有玻璃基板封装相关技术储备
Tongfu Microelectronics (002156.SZ) has reserves of glass substrate packaging related technologies.
The translation is provided by third-party software.
The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.