How do related companies respond to the rise in chip prices?
How do institutions evaluate the recently established national mega fund phase III?
Benefiting from the recent wave of semiconductor price increases, most of the semiconductor-related stocks in Hong Kong stock market rose today. As of the publication, they respectively rose by 5.59%, 2.83%, 2.24%.$HUA HONG SEMI (01347.HK)$, $SHANGHAI FUDAN (01385.HK)$, $SMIC (00981.HK)$They rose by 5.59%, 2.83%, and 2.24%, respectively.
In terms of news, according to institutional tracking, wafer foundry price adjustments have been transmitted to power semiconductor manufacturers. Since this year, power semiconductor manufacturers have experienced a wave of price increases. Among these, Sanan Optoelectronics increased the price of its entire series of products by 10-20%, Lansee Electronics increased the price of its entire series of products by 10-18%, GigaDevice raised the price of its entire line of products by 10-20%, and Jiangsu Jiejie Microelectronics raised the price of its Trench MOS by 5-10%.
At the same time, Taiwan Semiconductor has recently been rumored to increase the price of its wafer products. In response to this, Taiwan Semiconductor stated that the company's pricing strategy is based on strategic considerations rather than opportunism, and Taiwan Semiconductor will continue to maintain close cooperation with its customers.
Hua Hong Semiconductor leads the gains.
From the morning market trends, Hua Hong Semiconductor is leading the gains. According to a recent report by Morgan Stanley, the utilization rate of Hua Hong Semiconductor's wafer plant has exceeded 100%, and it is expected that wafer prices may be raised by 10% in the second half of the year.
Stimulated by this news, Hua Hong Semiconductor rose more than 8% at one point during the day.
In addition, the recently announced establishment of the national mega fund phase III has to some extent pushed up the investment enthusiasm for semiconductor-related stocks.
Ping An Securities stated that compared with the first and second phase of the fund, the third phase may continue to increase investments upstream in key equipment materials and components that match the manufacturing process, especially in advanced processes, advanced packaging related links, and may pay more attention to cutting-edge and relatively weak areas of AI chips and HBM.
Editor/new