On June 5th, Gleam Photonics (688439.SH) stated on the investor platform that the company currently has the third-generation advanced packaging technology capabilities represented by high-density FCBGA, which can meet various business scenarios such as domestic CPU/GPU, StarFlash communication chips or aviation computing fields, and is expanding advanced packaging such as RDL and Bumping.
振华风光(688439.SH)：正在扩展RDL、Bumping等先进封装
Zhenghua Fengguang (688439.SH): Expanding advanced packaging such as RDL and Bumping.
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