On June 5, Gelonhui reported that the main product of Naike Equipment (688419.SH) involved in the packaging industry chain is semiconductor packaging equipment, which serves the plastic packaging process of post-back-end process for semiconductor chip packaging. Currently, packaging equipment mainly works in two ways: transfer molding process and compression molding process, and compression molding process is mainly used for advanced packaging technology. Our company's transfer molding process equipment has mature technology, and the main products are 120T and 180T fully automatic packaging equipment. The compression molding process equipment has not yet achieved industrialization results in China, and our company has been conducting research and development in this area. The 23-year prototype has been formed and is currently in the internal testing, operation and optimization stage.