The Zhitong Finance App learned that TechInsights indicated that sales of semiconductor assembly and packaging equipment fell 26% to US$4.1 billion in 2023. Assembly equipment suppliers experienced a double-digit decline in the second year due to excessive investment in production capacity and subsequent overproduction resulting in excessive inventory levels. Nearly all market segments experienced double-digit declines, with sales of die attaching devices falling by 28.1%, wire bonding (wire bonding) falling by 49.8%, packaging (packaging) falling 23.7%, and cutting (dicing) performing the best, falling 2.5%.

TechInsights said that among leading assembly equipment suppliers, DISCO and APIC Yamada bucked the trend and achieved 3.6% and 29.9% growth in 2023, respectively. Companies targeting more mature markets such as automotive semiconductors performed well, but sales continued to decline. Leading assembly and packaging equipment companies include DISCO (cutting), BE Semiconductor (chip mount and package), ASMPT (chip mount, lead bonding and packaging), Kulicke & Soffa (lead bonding), and Towa (package).