Corning's South Korea business president, Vaughn Hall, said on Wednesday that Corning hopes to expand its share of the semiconductor glass substrate market with its proprietary technology. "I have high hopes for the future of glass substrates as they seem to have a competitive edge over the organic material substrates widely used in current chip packaging processes." Corning currently supplies two types of glass substrate products for chip production, one for temporary carriers in processor intermediary layers and the other for glass substrate products for wafer thinning in DRAM chips. In the future, Corning is preparing to launch glass cores for chip packaging and is providing samples to multiple potential customers.
康宁韩国业务总裁Vaughn Hall周三表示康宁希望利用其特殊的专有技术扩大其在半导体玻璃基板市场的份额。“我对玻璃基板未来的发展寄予厚望它似乎比目前芯片封装工艺中广泛使用的有机材料基板更具竞争优势。”康宁目前供应两种用于芯片生产的玻璃基板产品一种用于处理器中中介层的临时载体另一种用于DRAM芯片中晶圆减薄的玻璃基板产品。未来康宁正准备推出玻璃芯用于芯片封装公司正在向多个潜在客户提供样品。
Corning Korea business president Vaughn Hall said on Wednesday that Corning wants to use its special proprietary technology to expand its share of the semiconductor glass substrate market. “I have high hopes for the future development of glass substrates,
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