Gelonghui, May 24 | Wenyi Technology (600520.SH) said on an interactive platform that the company is committed to using domestic equipment to help manufacture in China, create value, and contribute to society. We have been deeply involved in the field of semiconductor packaging molds and equipment for more than 30 years, keeping up with new market trends and developing new products and technologies. The new technologies currently being developed by the company include but are not limited to technology related to panel-level fan-out packaging, etc.
文一科技(600520.SH)：目前研发的新技术包括但不限于面板级扇出型封装相关技术等
Wenyi Technology (600520.SH): New technologies currently being developed include but are not limited to panel-level fan-out packaging related technologies, etc.
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