Gelonghui, May 24 | Shuangyuan Technology (688623.SH) disclosed an investor relations activity record sheet showing that the company's technology research and development continues to expand into the field of semiconductor quantity detection, and has now completed prototype development of a fully automatic wafer AOI measurement system and an online wafer spectral measurement system. As of April 30, 2024, test prototypes of the company's AOI wafer misalignment detection system have been verified by the manufacturer and received a small number of orders. The device is based on the principle of brightfield reflection and uses high-magnification optical microscope imaging technology to achieve high-speed, accurate, and non-contact non-destructive optical inspection of SiC wafer misalignment defects. Combined with AI recognition algorithms, TSD, TED, and BPD defects in wafers can be accurately identified and classified. The signing of this order marks the company's official entry into the field of semiconductor quantity testing.