Gelonghui, May 22 | Shanghai Electric Power Co., Ltd. recently stated in an agency survey that the pace of changes in various disruptive trends such as electrification, intelligence, and connectivity in the automotive industry will not stop, and that the iteration of technology upgrades and increased penetration rates will provide strong long-term growth opportunities for the automotive board segment market in the fields of multi-layer, high-end HDI, high frequency high speed, high voltage resistance, high temperature resistance, and high integration. However, to a certain extent, automotive PCBs are characterized by insufficient supply in the emerging high-end market segment and oversupply in the middle and low end. Facing a more diverse, complex, and continuously changing automotive industry, the price competition for mid- and low-end automotive PCBs is expected to be more intense, posing a greater test and challenge to the hard and soft power of automotive board manufacturers.