“Science and Technology Innovation Board Daily”, May 22 — According to overseas media today quoting supply chain sources, Nvidia is planning to introduce its GB200 into fan-out panel-level packaging (FOPLP) as early as possible, from 2026 to 2025 in order to mitigate the problem of tight production capacity for advanced CoWOS packaging.

According to the report, the agency's latest report also confirmed the relevant news, and pointed out that Nvidia's GB200 supply chain has been launched and is currently in the design fine-tuning and testing stages. Judging from the CoWoS advanced packaging production capacity, it is estimated that 420,000 GB200 pieces will be delivered to the downstream market in the second half of this year, and next year's output will be 1.5 million to 2 million units.

Overall, under the trend of CoWoS production capacity being in short supply, the industry expects that fan-out panel-level packaging is also an advanced package, which is expected to be a powerful tool to ease the supply of AI chips.

The fan-out panel level package has many advantages, can accommodate more I/O numbers, is more efficient, and saves power consumption.

Notably, fan-out panel-level packages can use glass substrates, PCB substrates, and sealing substrates.

Among them, Zhongtai Securities pointed out on March 17 that among metal, glass and polymer substrates, glass substrates have characteristics such as high interconnection density, superior mechanical/physical/optical properties, and high temperature resistance, and have good development prospects. Its better thermal stability and mechanical stability can greatly increase the interconnection density on the substrate, and has better electrical performance, thus achieving high-density, high-performance chip packaging. Furthermore, the glass substrate has an ultra-low flatness, which can reduce deformation.

In January of this year, it was also reported that Intel is negotiating a panel-level fan-out package cooperation with Inntron. At that time, Intel had already released a new generation of advanced packaging solutions for glass substrates. Since then, Inventive has successfully received orders for panel-level fan-out packages, and Intel is actively seeking cooperation.

Furthermore, a number of manufacturers have also launched FOPLP layouts.

Also, according to incomplete statistics from the “Science and Technology Innovation Board Daily”, the relevant manufacturers in A-shares also include: