Glass substrate packaging concept stocks continue to strengthen. Tiancheng Technology, Dyl Laser, Delong Laser, Sanchao New Materials, and Rayman Optoelectronics all rose and fell 20cm, and multiple seals such as Vogue Optoelectronics and Wufang Optoelectronics. According to news, the advanced packaging process adopted by Nvidia GB200 will use glass substrates.
玻璃基板封装概念股持续走强，天承科技、帝尔激光、德龙激光、三超新材、雷曼光电均20cm涨停，沃格光电、五方光电等多股封板，消息上，英伟达GB200采用的先进封装工艺将使用玻璃基板。
Glass substrate packaging concept stocks continue to strengthen. Tiancheng Technology, Dyl Laser, Delong Laser, Sanchao New Materials, and Rayman Optoelectronics all rose and fell 20cm, and multiple seals such as Vogue Optoelectronics and Wufang Optoelect
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