Gelonghui, May 13丨An investor asked Xing Sen Technology (002436.SZ) on the investor interactive platform, “Advanced chip packaging technology has become mainstream in AI chip packaging. Do advanced packaging technologies such as wafer-level packaging, 2.5D, and 3D have to use FCBGA carriers? Which manufacturers are currently supplying the company's FCBGA carrier boards?” The company replied that the company's FCBGA packaging substrate is a raw material for chip packaging and can be applied to advanced packaging technologies such as 2.5D and 3D, and that chip design companies and packaging manufacturers at home and abroad are the company's target customers.
兴森科技(002436.SZ)：FCBGA封装基板是芯片封装原材料，可应用于2.5D、3D等先进封装技术
Xing Sen Technology (002436.SZ): FCBGA packaging substrates are raw materials for chip packaging and can be used in advanced packaging technologies such as 2.5D and 3D
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