Gelonghui, May 10 | Dike Co., Ltd. (300842.SZ) said on the investor interactive platform that in the field of semiconductor electronic materials, the company is promoting and selling high-reliability semiconductor packaging materials, including: LED chip bonding silver paste, IC chip bonding silver, power semiconductor chip bonding sintering silver, power semiconductor AMB ceramic copper clad plate brazing paste, etc., and there is no direct cooperation with SMIC.
帝科股份(300842.SZ)：与中芯国际没有直接合作
Dico Co., Ltd. (300842.SZ): No direct cooperation with SMIC
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