GLONGHUI April 26 | TSM.US (TSM.US) rose 1.3% to $138.36 in the premarket. According to the news, TSMC's system-level wafer technology will usher in a major breakthrough. The company said that the chip-stacked version using CoWOS technology is expected to be ready in 2027 to integrate SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to data center server racks or even entire servers.
美股异动丨台积电盘前涨超1% 系统级晶圆技术将迎重大突破
Changes in US stocks 丨 TSMC's previous rise of more than 1% system-level wafer technology will usher in a major breakthrough
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