The Zhitong Finance App learned that ASMPT (00522) is now up nearly 5%. As of press release, it has risen 4.56% to HK$99.8, with a turnover of HK$77.2982 million.

According to media reports, TSMC's system-level wafer technology will usher in a major breakthrough. The company said that the chip-stacked version using CoWOS technology is expected to be ready in 2027 to integrate SoIC, HBM and other components to create a powerful wafer-level system with comparable computing power to a data center server rack or even an entire server.

According to a research report published by Macquarie, ASMPT Advanced Packaging (AP)'s long-term growth visibility increased, raising earnings estimates by 25% and 3% respectively, and raising the valuation base from 1.6 times the predicted market account ratio to 2.7 times, and the target price surged 88% to HK$117.81; considering that AP orders from fabs and the like are expected to increase, the rating will also rise from “outperforming the market” to “outperforming the market.”

According to Open Source Securities, despite the poor prosperity of the traditional packaging business in 2024, TCB equipment shipments are expected to be significantly higher than in 2023, and the value and profit margin of TCB equipment are significantly higher than those of the traditional packaging business, which is expected to drive an increase in overall net profit in 2024. It is expected that TCB equipment will continue to be rapidly released in 2025-2026. At the same time, the traditional packaging business boom will pick up and operating leverage will significantly drive improved profitability, which is expected to drive high net profit growth in 2025-2026.