The following is a summary of the BE Semiconductor Industries N.V. (BESIY) Q1 2024 Earnings Call Transcript:

Financial Performance:

• BE Semiconductor reported Q1 revenue of €146.3 million, up 9.7% year-on-year.

• Order trends decreased by 10.1% compared to Q1 the previous year and declined by 23.3% sequentially.

• Net income, adjusted for share-based compensation, increased by 15.1% to €49.5 million compared to the same quarter last year.

• Gross margins increased by 3.0 points to 67.2% due to a favorable product mix and net forex benefits.

• Expenses were controlled with increased R&D spending to support next-generation product development.

• Net cash increased by 60.1% from the year-end to reach €180.9 million.

Business Progress:

• BE Semiconductor is expanding its advanced packaging market share in 2.5D, 3D, and photonics applications to cater to expected strong growth for AI-related applications.

• The company anticipates orders for 25 to 35 hybrid bonding systems in Q2.

• BE Semiconductor is increasing R&D investment in assembly processes to capitalize on anticipated growth in the period 2024, 2025 and 2027.

• The company's progress on its hybrid bonders has been positive and a second TC system has recently been shipped and is being installed.

• BESIY plans to have the 50 nanometer system ready by the end of 2025 and is evaluating both TCB and hybrid bonding for smartphone applications.

Tips: For more comprehensive details, please refer to the IR website. The article is only for investors' reference without any guidance or recommendation suggestions.