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中银证券4月25日发布研报称,维持德邦科技(688035.SH)增持评级。评级理由主要包括:1)2023年公司业绩承压,研发投入加大;2)集成电路封装材料产销量同比提升,有望成为新的收入增长点;3)公司持续巩固智能终端封装材料、新能源应用材料市场优势,产能及海外布局持续推进。(每日经济新闻)

Bank of China Securities released a research report on April 25 stating that it maintains Debon Technology (688035.SH)'s holdings increase rating. The main reasons for the rating include: 1) the company's performance is under pressure in 2023, and R&D inv

Zhitong Finance ·  Apr 25 14:12
Bank of China Securities released a research report on April 25 stating that it maintains Debon Technology (688035.SH)'s holdings increase rating. The main reasons for the rating include: 1) the company's performance is under pressure in 2023, and R&D investment increased; 2) the year-on-year increase in production and sales of integrated circuit packaging materials is expected to become a new revenue growth point; 3) the company continues to consolidate its market advantages in smart terminal packaging materials and materials for new energy applications, and production capacity and overseas layout continue to advance. (Mainichi Keizai Shimbun)

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