Gelonghui, April 2 | Sanfu Xinke (688359.SH) said on an interactive platform that Mingyi Electronics' main equipment products in the PCB field include special equipment such as chip VCP and roll-to-roll VCP electroplating, which are used in electroplating processes in the fields of consumer electronics, communication equipment, 5G base stations, servers, automobiles, etc.; in the semiconductor field, the main equipment products use semiconductor PLP processes, 3D advanced packaging processes, and electroplating processes such as wafers. Mingyi semiconductor electroplating equipment has shipped to many well-known domestic semiconductor 3D packaging and wafer companies, and is currently in negotiations with many well-known PCB and 3D packaging suppliers. With the recovery of the consumer electronics industry, it is expected to contribute to the company's overall specialty chemicals and equipment business in the PCB and semiconductor sector.