Gelonghui March 25 | Sirui New Materials (688102.SH) said on the investor interactive platform that the tungsten-copper alloy material developed by the company has low expansion and higher thermal conductivity, and tungsten-copper alloys with different components can meet the needs of 400G, 800G, and 1.6T optical modules. Based on strong demand from the downstream market, the company has planned to build a “project with an annual output of 20 million sets of optical module chip base/case materials and components”. For other information, please refer to the periodic report.