GLONGHUI March 21丨Debon Technology (688035.SH) said on the investor interactive platform that currently the company's products have not been used in HBM. HBM is a DRAM memory chip based on a 3D stacking process. It is stacked with multiple layers of DRAM, and each layer of DRAM is welded together through a bump. After welding, there will be a gap between the DRAM and DRAM. The bump is very fragile and needs to be protected with bottom filler to balance the stress. Existing models of the company's chip-grade underfill (Underfill) have been verified by some domestic customers. Whether they can be used in HBM in the future depends on various factors such as customer process, product performance matching, and customer supply chain choices. The company will continue to pay attention to industry trends and promptly follow up on possible future industrialization opportunities for domestic HBM.