Gelonghui, March 21丨Debon Technology (688035.SH) said on the investor interactive platform that the company's fixed crystal series products, UV film series products, thermal conductivity series products, chip-level underfill adhesives (Underfill), and lid frame bonding materials (AD adhesives) can all be used in the field of storage chips. Among them, some products in the crystal fixing series and thermal conductivity series have already been applied. The company will continue to pay attention to domestic and foreign storage industry trends, actively promote the application of related products, and expand market share.
德邦科技(688035.SH)：公司固晶系列产品等均可应用在储存芯片领域
Debon Technology (688035.SH): The company's solid crystal series products can be used in the field of storage chips
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