GLONGHUI, March 11 | Dahua Jixian published a report that is optimistic about the future of ASMPT. It is based on the accelerated development of GeNAI technology and the increase in design and requirements for high-end artificial intelligence (AI) chips. It believes that ASMPT, as the world's leading supplier of thermocompression bonding (TCB) chip packaging technology, is expected to benefit from it. Therefore, it was given a “buy” rating for the first time, with a target price of HK$115. According to the bank, TCB is a key pillar in the evolution of AI chips. Driven by the rapid expansion of TCB applications, the global TCB market is expected to reach a 3-year compound annual growth rate (CAGR) of 63% from 2023 to 2026. Although ASMPT is expected to lose some of its market share due to competition from new entrants, its TCB business is expected to grow at a 3-year CAGR of 49%, and its revenue contribution will soar from 6.4% in 2023 to 14.1% in 2026. Furthermore, the bank estimates that the Group's semiconductor solutions (SEMI solutions) and other advanced packaging solutions will recover this year.