Gelonghui March 7 丨 Some investors asked Yitian Co., Ltd. (300812.SZ) on the investor interactive platform, “Does the company have advanced packaging technology?” The company replied that in the field of semiconductor-related special equipment, the company has developed wafer coating equipment in semiconductor-related laminating equipment. This process is applied before wafer thinning, and has been approved by customers. The holding subsidiary Microchip Semiconductor-related semiconductor packaging equipment can be used for advanced packaging such as WLP (wafer level packaging) and SIP (system level packaging).
易天股份(300812.SZ)：已在半导体相关覆膜设备方面研发出了晶圆附膜设备
Yitian Co., Ltd. (300812.SZ): It has developed wafer coating equipment in semiconductor-related laminating equipment
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