Due to strong AI demand, orders for HBM and DDR5 are expected to increase. Samsung Electronics and SK Hynix are increasing their focus on high-value DRAM products and are considering increasing the factory's semiconductor wafer input to speed up the transition to 10 nm fourth generation (1a) and fifth generation (1b) versions to produce high-value products such as HBM, DDR5, and LP-DDR5.
Due to strong AI demand, orders for HBM and DDR5 are expected to increase. Samsung Electronics and SK Hynix are increasing their focus on high-value DRAM products and are considering increasing the factory's semiconductor wafer input to speed up the transition to 10 nm fourth generation (1a) and fifth generation (1b) versions to produce high-value products such as HBM, DDR5, and LP-DDR5.
On February 23, Kim Ki-tae, vice president of SK Hynix, said that Hynix's HBM production capacity was sold out in 2024. Earlier, during the performance conference, Micron also stated that thanks to increased demand for generative AI, Micron's HBM production capacity in 2024 is expected to be fully sold out. Tianfeng Securities anticipates that 2024 may be a big year for HBM to expand production. Demand for HBM and advanced packaging materials is expected to continue to grow, and industry chain opportunities are worth paying attention to.
According to the Finance Federation's theme library, among the relevant listed companies:
Yaktech is the world's leading supplier of precursors. The company's products are used for 8 or 12 DRAM discs stacked in the AI server HBM3.
Lianrui New Materials continues to launch a variety of functional powder materials such as low α micron/submicron spherical silicon powder and spherical alumina powder with low cut-point specifications. The company supplies spherical silicon and low α spherical aluminum used in HBM.