Gelonghui March 4 | Jiaocheng Ultrasound (688392.SH) said on an interactive platform that the company's ultrasonic copper wire bonding machines have now formed small-batch orders and continue to strengthen related market development. In the semiconductor field, the company has reached cooperation with well-known companies such as CRRC Era, SMIC, Silan Semiconductor, Macro Technology, and SAIC Infineon. Currently, the company can provide customers with ultrasonic application solutions such as ultrasonic aluminum wire bonding machines, ultrasonic copper wire bonding machines, ultrasonic semiconductor terminal welding equipment, ultrasonic pin ultrasonic welding equipment, ultrasonic scanning microscopes, etc., and continues to increase R&D investment to actively promote the development of the company's emerging businesses.
骄成超声(688392.SH)：超声波铜线键合机已形成小批量订单
Jiaocheng Ultrasound (688392.SH): Ultrasonic copper wire bonding machines have been ordered in small batches
The translation is provided by third-party software.
The above content is for informational or educational purposes only and does not constitute any investment advice related to Futu. Although we strive to ensure the truthfulness, accuracy, and originality of all such content, we cannot guarantee it.